With our technology we can do metal coatings on flat wafers in a wide range of materials.
Commonly used metals are copper, silver, gold, aluminum, titanium. Other materials can be tried on request.
To improve adhesion we can apply a plasma cleaning step prior to deposition or deposit a nm thin layer of adhesive metal like Cr or Ti.
Typical substrate dimensions are 2", 3" or 4" but also square or rectangular dimensions are possible.
Film thickness typically ranges from 10 nm to 3 µm.