With our technologies - thermal evaporation, electron beam deposition and magnetron sputtering - ceraco can do metal coatings on flat wafers in a wide range of materials. Commonly used metals are copper, silver, gold, aluminum and titanium.
Typical substrate dimensions are 2", 3" and 4" wafers but also square or rectangular shapes are possible.
The film thickness typically ranges from 10 nm to 3 µm.
To improve adhesion we can apply an oxygen plasma-cleaning step or deposit a thin layer (nanometer range) of adhesive metal like Cr or Ti prior to the desired metal deposition.
Ceraco´s deposition technologies are suited both for common oxides (CeO2, SiO2, MgO, Al2O3, etc) and complex oxides with two or more metal constituents (e.g. DyBa2Cu3O7 or Ce0,8Gd0,2O2).
Get in touch with us regarding your needs in metal and oxide coatings!